This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.
IPC J-STD-013:1996
Original price was: $142.00.$71.00Current price is: $71.00.
Implementation of Ball Grid Array and Other High Density Technology
Association Connecting Electronics Industries , 08/01/1996
Pages: 123
