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IPC 4563:2007 pdf

IPC 4563:2007

Original price was: $101.00.Current price is: $50.00.

Resin Coated Copper Foil for Printed Boards Guideline

Association Connecting Electronics Industries , 11/01/2007

Pages: 19

Category:
Standard By:Association Connecting Electronics Industries , 11/01/2007
Published:11/01/2007
Pages:19
File Size:1 file , 270 KB
Language:English
Note:This product is unavailable in Russia, Ukraine, Belarus
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

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IPC 4563:2007 pdf
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