IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
IEC 62899-202-5 Ed. 1.0 en:2018
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Printed electronics – Part 202-5: Materials – Conductive ink – Mechanical bending test of a printed conductive layer on an insulating substrate
International Electrotechnical Commission , 09/28/2018
Pages: 15
