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IEC 62769-4 Ed. 3.0 b:2023 pdf
IEC 62769-4 Ed. 3.0 b:2023 pdf
IEC 62769-4 Ed. 3.0 b:2023 pdf
IEC 62769-4 Ed. 3.0 b:2023 pdf
IEC 62769-4 Ed. 3.0 b:2023 pdf
  1. IEC 62769-4 Ed. 3.0 b:2023 pdf
  2. IEC 62769-4 Ed. 3.0 b:2023 pdf
  3. IEC 62769-4 Ed. 3.0 b:2023 pdf
  4. IEC 62769-4 Ed. 3.0 b:2023 pdf
  5. IEC 62769-4 Ed. 3.0 b:2023 pdf

IEC 62769-4 Ed. 3.0 b:2023

Original price was: $455.00.Current price is: $227.00.

Field Device Integration (FDI) – Part 4: FDI Packages

International Electrotechnical Commission , 04/01/2023

Pages: 186

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Category:
Standard By:International Electrotechnical Commission , 04/01/2023
Published:04/01/2023
Pages:186
ISBN(s):9782832267943
File Size:1 file , 3 MB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

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