Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
IEC 61192-3 Ed. 1.0 b:2002
Original price was: $281.00.$140.00Current price is: $140.00.
Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assemblies
International Electrotechnical Commission , 12/17/2002
Pages: 93
