Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
IEC 61190-1-2 Ed. 1.0 b:2002
Original price was: $67.00.$33.00Current price is: $33.00.
Attachment materials for electronic assembly – Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
International Electrotechnical Commission , 03/22/2002
Pages: 35
