The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
IEC 61188-1-2 Ed. 1.0 b:1998
Original price was: $281.00.$140.00Current price is: $140.00.
Printed boards and printed board assemblies – Design and use – Part 1-2: Generic requirements – Controlled impedance
International Electrotechnical Commission , 04/29/1998
Pages: 83
