IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
IEC 60749-40 Ed. 1.0 b:2011
Original price was: $190.00.$95.00Current price is: $95.00.
Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge
International Electrotechnical Commission , 07/13/2011
Pages: 44
