Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
IEC 60749-37 Ed. 1.0 b:2008
Original price was: $133.00.$66.00Current price is: $66.00.
Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
International Electrotechnical Commission , 01/30/2008
Pages: 39
