Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
IEC 60749-25 Ed. 1.0 b:2003
Original price was: $95.00.$47.00Current price is: $47.00.
Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling
International Electrotechnical Commission , 07/11/2003
Pages: 25
