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IEC 60749-22 Ed. 1.0 b:2002 pdf
IEC 60749-22 Ed. 1.0 b:2002 pdf
IEC 60749-22 Ed. 1.0 b:2002 pdf
IEC 60749-22 Ed. 1.0 b:2002 pdf
IEC 60749-22 Ed. 1.0 b:2002 pdf
  1. IEC 60749-22 Ed. 1.0 b:2002 pdf
  2. IEC 60749-22 Ed. 1.0 b:2002 pdf
  3. IEC 60749-22 Ed. 1.0 b:2002 pdf
  4. IEC 60749-22 Ed. 1.0 b:2002 pdf
  5. IEC 60749-22 Ed. 1.0 b:2002 pdf

IEC 60749-22 Ed. 1.0 b:2002

Original price was: $190.00.Current price is: $95.00.

Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength

International Electrotechnical Commission , 09/12/2002

Pages: 41

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Category:
Standard By:International Electrotechnical Commission , 09/12/2002
Published:09/12/2002
Pages:41
File Size:1 file , 720 KB
Language:English, French
Note:This product is unavailable in Ukraine, Russia, Belarus
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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