Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
IEC 60749-21 Ed. 1.0 b:2004
Original price was: $110.00.$55.00Current price is: $55.00.
Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability
International Electrotechnical Commission , 03/15/2004
Pages: 45
