Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
IEC 60749-14 Ed. 1.0 b:2003
Original price was: $95.00.$47.00Current price is: $47.00.
Semiconductor devices – Mechanical and climatic test methods – Part 14: Robustness of terminations (lead integrity)
International Electrotechnical Commission , 08/07/2003
Pages: 27
