IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
IEC 60191-6-17 Ed. 1.0 b:2011
Original price was: $234.00.$117.00Current price is: $117.00.
Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
International Electrotechnical Commission , 01/27/2011
Pages: 53
