Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
IEC 60191-6-12 Ed. 1.0 en:2002
Original price was: $100.00.$50.00Current price is: $50.00.
Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch land grid array (FLGA) – Rectangular type
International Electrotechnical Commission , 06/14/2002
Pages: 20
