Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
IEC 60191-5 Ed. 2.0 b:1997
Original price was: $278.00.$139.00Current price is: $139.00.
Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
International Electrotechnical Commission , 04/23/1997
Pages: 71
