Standard By:International Electrotechnical Commission , 03/27/2018
Published:03/27/2018
Pages:29
File Size:1 file , 670 KB
Language:English, French
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IEC 60191-4 Amd.1 Ed. 3.0 b:2018
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Amendment 1 – Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
International Electrotechnical Commission , 03/27/2018
Pages: 29
