This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.Cross References:IEC 60068-2-20:2008IEC 61189-5-501
BS PD IEC TR 61189-5-506:2019
Original price was: $264.16.$132.00Current price is: $132.00.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
BSI Group , 07/18/2019
Pages: 26
