IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.
IEC 62951-3 Ed. 1.0 en:2018
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Semiconductor devices – Flexible and stretchable semiconductor devices – Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
International Electrotechnical Commission , 11/07/2018
Pages: 22
