IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
IEC 62878-1-1 Ed. 1.0 b:2015
Original price was: $367.00.$183.00Current price is: $183.00.
Device embedded substrate – Part 1-1: Generic specification – Test methods
International Electrotechnical Commission , 05/20/2015
Pages: 109
