The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
IEC 62137-1-1 Ed. 1.0 b:2008
Original price was: $77.00.$38.00Current price is: $38.00.
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test
International Electrotechnical Commission , 05/14/2008
Pages: 30
