Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
IEC 61188-5-2 Ed. 1.0 b:2003
Original price was: $367.00.$183.00Current price is: $183.00.
Printed boards and printed board assemblies – Design and use – Part 5-2: Attachment (land/joint) considerations – Discrete components
International Electrotechnical Commission , 06/24/2003
Pages: 103
